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    基于硅脂的封装对反式钙钛矿太阳能电池性能和稳定性的影响

    Impact of Silica-Based Packaging on the Performance and Stability of Trans-Perovskite Solar Cells

    • 摘要: 针对钙钛矿太阳能电池长期稳定性不足和现有封装工艺复杂的问题,提出一种基于硅脂的简易封装策略,系统探究其对反式钙钛矿太阳能电池性能与稳定性的影响。通过紫外-可见吸收光谱、瞬态光电流/电压谱及电化学阻抗谱等表征手段,发现硅脂封装可有效隔绝水氧侵蚀,抑制钙钛矿活性层的降解,并通过界面钝化作用将缺陷密度从7.4×1015 cm-3降至6.6×1015 cm-3。同时,手动层压封装对器件施加轻微压力,优化了钙钛矿与电荷传输层(ETL/HTL)的物理接触,减少界面微裂纹,提升载流子传输效率,使瞬态光电压衰减时间从6.1 ms延长至13.2 ms。基于ITO/Me-4PACz/PVSK/PCBM/BCP/Ag结构的反式钙钛矿电池,在25±5 ℃、30±5%湿度条件下,封装后器件1 500 h后仍保留91.7%的初始光电转换效率(PCE),显著优于未封装器件(600 h后仅存37.8%)。该策略解决了传统高温封装工艺与钙钛矿化学敏感性的矛盾,兼具高阻隔性、简易和可拆卸优势,为钙钛矿组件的商业化应用及全寿命周期管理提供了新思路。

       

      Abstract: In this study, an innovative and straightforward packaging strategy utilizing silicone grease was proposed to tackle the long-term stability challenges of perovskite solar cells as well as the complexity associated with current packaging methods. Additionally, its impact on the performance and stability of trans-perovskite solar cells was systematically investigated. Characterization techniques, including UV-Vis absorption spectroscopy, transient photocurrent/voltage spectroscopy, and electrochemical impedance spectroscopy, revealed that the silicone grease encapsulation effectively isolates moisture and oxygen, suppresses perovskite degradation, and passivates interfacial defects, reducing trap density from 7.4×1015 cm-3 to 6.6×1015 cm-3. The lamination process applies gentle pressure, optimizing physical contact between the perovskite and charge transport layers (ETL/HTL), minimizing interfacial microcracks, and enhancing carrier transport efficiency. Consequently, the transient photovoltage decay time was prolonged from 6.1 ms to 13.2 ms. For inverted PSCs with an ITO/Me-4PACz/PVSK/PCBM/BCP/Ag architecture, the encapsulated devices retained 91.7% of their initial power conversion efficiency (PCE) after 1 500 hours under 25±5 ℃ and 30±5% relative humidity, significantly outperforming unencapsulated counterparts (37.8% PCE retention after 600 hours). This strategy resolves the contradiction between traditional high-temperature encapsulation processes and the chemical sensitivity of perovskite materials, offering combined advantages of high barrier performance, simplicity, and disassemblability. It provides novel insights for the commercial application of perovskite modules and their full life cycle management.

       

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