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    相位测量偏折术中基于平均曲率的缺陷检测方法

    Defect Detection Method Based on Mean Curvature in Phase Measurement Deflectometry

    • 摘要: 针对镜面反射物体的缺陷检测,传统方法易受反光干扰、微小缺陷(如发丝级划痕、细微凹点)识别能力弱、依赖单一图像处理导致检测精度不足的问题,提出了一种基于相位测量偏折术与平均曲率的缺陷检测方法,该方法以相位测量偏折术(Phase Measurement Deflectometry,PMD)所获取的梯度信息作为基础,计算平均曲率图,再通过去噪预处理、直方图均衡化(Histogram Equalization)和边缘检测等图像处理操作,实现缺陷的精准检测。手机壳实测结果表明,平整区域平均曲率为9.935×10-5,而缺陷处凹点平均曲率分别为-1.843×10-3、-2.060×10-3,裂纹平均曲率为-4.640×10-3,缺陷区域平均曲率绝对值明显更大;与传统白光照明检测方法相比,所提方法可完整呈现凹点闭合轮廓与裂纹连续锐利边缘,有效规避反光导致的伪边缘干扰,缺陷识别精度显著提升,能有效识别手机壳表面的凹点和裂纹等缺陷,为工业产品提供了一种新的的高精度缺陷检测方案。

       

      Abstract:
      For defect detection of specular reflection objects, traditional methods are prone to interference from reflections, have weak recognition capability for tiny defects (such as hairline scratches and subtle Pits), and suffer from insufficient detection accuracy due to reliance on single image processing. To address these issues, a defect detection method based on phase measurement deflectometry and mean curvature is proposed. This method uses the gradient information acquired by phase measurement deflectometry (Phase Measurement Deflectometry) as the basis to compute the mean curvature map, and then achieves accurate defect detection through image processing operations such as denoising preprocessing, histogram equalization, and edge detection. The actual measurement results of the phone case show that the mean curvature of the flat area is 9.935×10-5, while the mean curvatures of pits at the defect locations are -1.843×10-3 and -2.060×10-3 respectively, and the mean curvature of cracks is -4.640×10-3. The absolute values of the mean curvature in the defect areas are significantly bigger. Compared with the traditional white light illumination detection method, the proposed method can completely render the closed outline of pits and the continuous sharp edges of cracks, effectively avoid the interference of pseudo-edges caused by reflections, and significantly improve the defect recognition accuracy. It can effectively identify defects such as pits and cracks on the surface of phone cases, providing a new high-precision defect detection solution for Industrial products.

       

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